Journal of Nanomaterials & Molecular NanotechnologyISSN: 2324-8777

Dongyan Ding

Dongyan Ding, PhD
School of Materials Science and Engineering
Shanghai Jiao Tong University, China

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Dr. Dongyan Ding received his BS and MS degrees from Henan University of Science and Technology, both in materials science. In 2000, he obtained his PhD degree in materials science from Harbin Institute of Technology. He did a two-year postdoctoral work and later became an associate professor at School of Materials Science and Engineering in Shanghai Jiao Tong University. From 2004 to 2006, he was a visiting scholar in Center for Nanoscale Science and Engineering and Department of Electrical Engineering, University of Kentucky. His current research interests include microelectronic materials and technology, nanosensors and heat-transfer materials. Dr. Ding is an active member in several professional societies including Shanghai Nonferrous Society and CMRS Youth Branch. He has served as the general-secretary of the 8th International Conference on Electronic Packaging Technology and the 2009 International Forum on Electronic Interconnect Technology. He has published more than sixty papers and hold five patents. One of his papers received the Excellent Paper Award in ICEPT-HDP2009 conference and three of his journal papers were reported in the IOP Nanotechnology website. His sponsors include Siemens, Air Liquide, Huafon Al, Shanghai Shenkai, etc.

Research Interest

Dr. Dongyan Ding's research interests include:



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